MEASURING DEVICE OF SUBSTRATE WARPAGE AND MEASURING METHOD USING THE SAME

摘要

The present invention relates to a substrate warping measurement device and a measurement method using the same. The substrate warping measurement device comprises a surface plate with multiple through holes; a measurement unit which is formed on one side of the surface plate and has an ultrasonic transceiver transmitting and receiving ultrasonic waves to or from a substrate; and a control unit which controls the measurement unit.