WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To easily discriminate a pattern formed on a resist layer from the resist layer of a wiring board.SOLUTION: A first conductor pattern 110 is formed on an upper surface of a first insulation layer 11a of a wiring board 10, and a via conductor 112b penetrates through a second insulation layer 11b to be connected with the first conductor pattern 110. A second conductor pattern 120 is formed on an upper surface of the second insulation layer 11b. A pad 122 is formed at the peripheral side of the second conductor pattern 120. A solder resist layer 12 is formed on the pad 122 and a dam 13 is formed on an upper surface of the solder resist layer 12. The upper surface of the solder resist layer 12 is green and the upper surface of the dam 13 is yellow.