| 摘要 |
PROBLEM TO BE SOLVED: To maintain the interval between chips, divided by expanding an expanded sheet stuck to a workpiece, reliably regardless of the type of the expanded sheet.SOLUTION: A wafer 1 mounted on a table 31 with an expanded sheet 11 interposed therebetween is divided into a plurality of chips 3A, by expanding the expanded sheet 11 with expansion means 30. Subsequently, expansion of the expanded sheet 11 is released, a raised portion 11b is formed by raising a surplus part of the expanded sheet 11, and then the interval between the chips 3A is maintained by crimping the raised portion 11b with crimp means 70. In such a device for maintaining the interval between chips 3A, both sides of the crimp means 70 in the expanded sheet 11 is pushed up by a support bar 80 disposed on an outer peripheral table 73 in crimping the raised portion 11b, so as to support the raised portion 11b thus forming and crimping the raised portion 11b reliably. |
