发明名称 METHOD OF MANUFACTURING LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a lead frame which allows for formation of a silver pad electrode layer with excellent dimensional accuracy by using an ink jet method.SOLUTION: A method of manufacturing a lead frame includes a coating step for preparing a lead frame base material 1 including a die pad 1a, inner lead 1b and an outer lead 1c, with a copper strike plating layer 2 being formed on one surface of the inner lead, and coating the copper strike plating layer with silver nano ink 31 by ink jet method to form a silver pad electrode layer 3. In the coating step, the silver pad electrode layer is formed by applying the silver nano ink under coating conditions of surface tension of the silver nano ink in the range of 24-38 mN/m, and flight velocity of the silver nano ink in the range of 3-20 m/s.
申请公布号 JP2014107512(A) 申请公布日期 2014.06.09
申请号 JP20120261659 申请日期 2012.11.29
申请人 DAINIPPON PRINTING CO LTD 发明人 HAYASHI SHINJI
分类号 H01L23/50 主分类号 H01L23/50
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