| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance reliability for tension by forming a sufficient solder fillet, when soldering an electronic component to a circuit board by surface mounting technique, thereby preventing poor connection, e.g., withdrawal of the electronic component.SOLUTION: With regard to a circuit board and a method of mounting an electronic component on the circuit board, the circuit board has a pad pattern including a basic pattern and at least one additional pattern connected with the basic pattern. The basic pattern includes a region to which the connection terminal of an electronic component is bonded by solder. The at least one additional pattern includes a region to which the connection terminal of an electronic component is not bonded. The basic pattern includes an exposed side or an exposed point arranged to limit the mounting position so that the electronic component does not exceed an alignment margin.</p> |
