| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate structure that has a thin plating difficult to be removed, is excellent in wire bondability and sulfur resistance, does not reduce reflectance even under severe heat treatment conditions, and that allows for longer life, cost reduction and quality improvement, a light reflection plate having the laminate structure as reflection plate, and a light-emitting diode device.SOLUTION: The laminate structure includes a Ni plating layer and an In-Ag layer containing In of 40 mass% or more and 90 mass% or less on a Cu or Cu alloy, the In-Ag layer containing Cu. |
