| 摘要 |
PROBLEM TO BE SOLVED: To increase the bonding force to a solder ball by forming resist gradually, and differentiating the diameter of apertures formed in the resist layer at respective stages.SOLUTION: A resist 100 covering a pad layer formed on the outer layer of a substrate, and having a via hole 100a so as to partially expose the upper surface of the pad layer is configured so that resist layers 110, 120, each having an aperture 110a formed therein, are laminated in multilayer. The aperture 110a formed in each resist layer has a diameter smaller than that of the aperture of a resist layer laminated on the upper surface of each resist layer 110, 120. A production method of resist is also provided. |
