| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mounting device which can determine quality of an application region of a conductive paste agent for joining an electrode pattern of a printed substrate and an electrode pad of a chip device, after mounting.SOLUTION: A light-emitting device 100 is a flip-chip mounting device including a light-emitting element 2 mounted on a substrate 1 with a conductive paste agent 3. The substrate 1 includes: a substrate electrode 20 formed in a first region R1; a plurality of conductive lands 10 formed in a second region R2 with a predetermined interval with each other therefor; a plurality of electrode pads 11 formed in a third region R3; and wiring 12 for connecting each of the conductive lands 10 and each of the electrode pads 11. The light-emitting element 2 includes a chip electrode 30 and is placed on the substrate 1 so as to cover the first region R1 and the second region R2. The conductive paste agent 3 electrically connects the substrate electrode 20 and the chip electrode 30 in the first region R1, and is applied to a predetermined position with respect to the plurality of conductive lands 10 in the second region R2. |
