| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of suppressing the amount of inert gas or dry gas used, while preventing decrease in throughput.SOLUTION: A substrate processing apparatus 10 includes a loader module 13, an opener 42 for housing a plurality of wafers W and removing a lid 32 from an FOUP 30 having a body 31, an aperture 33 and the lid 32, and interconnecting the inside of the FOUP 30 and the inside of the loader module 13 through the aperture 33, an Ngas supply unit 47 for supplying Ngas to the inside of the FOUP 30 attached to the loader module 13, and two planar slide lids 43, 44 movable freely along the aperture plane of the aperture 33. The slide lids 43, 44 approach each other until the mutual gap becomes 1-3 mm, thus shielding the aperture 33 of the FOUP 30 attached to the loader module 13 from the inside thereof. |
