| 摘要 |
<p>Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
A disclosed photosensitive composition comprises:
a binder polymer prepared by free radical polymerization of acrylic acid and/or methacrylic acid with one or more monomers chosen from acrylate monomers, methacrylate monomers and vinyl aromatic monomers;
a free radical polymerizable monomer bearing two or more ethylenically unsaturated groups,
a free radical photoinitiator; and
a stable free radical inhibitor.
The binder polymer is prepared e.g. by free radical polymerization of ethyl acrylate, methyl methacrylate, and methacrylic acid.
The stable free radical inhibitor comprises e.g. 2,2,6,6-tetramethyl-1-piperidinyloxy, 2,2-diphenyl-1-picrylhydrazyl, or a derivative thereof.</p> |
