METHOD FOR MANUFACTURING SOLDER BUMP

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a solder bump with high void occurrence prevention effect, and a method for soldering an electronic component.SOLUTION: A method for forming a solder bump on a pad provided in a substrate comprises the steps of: holding a paste-like solder supplied onto the pad in a temperature region in which the viscosity of the solder is not more than 10 Pa s for 60 to 300 seconds (first preheating step); holding the solder at a higher temperature than the first preheating step and at a lower temperature than a reflow temperature (second preheating step); and heating the solder at the reflow temperature after the second preheating step (reflow heating step).