| 摘要 |
PROBLEM TO BE SOLVED: To provide a white photosensitive resin composition excellent in stability in a varnish state and excellent in coating film forming property, and to provide a dry film type alkali-developable white photosensitive solder resist.SOLUTION: The photosensitive resin composition comprises (a) a resin having an ethylenically unsaturated group and a carboxyl group, (b) a photopolymerizable monomer having an ethylenically unsaturated group, (c) a photopolymerization initiator, (d) a thermosetting agent, and (e) a white pigment, in which the (e) white pigment has an average particle diameter of 0.1 to 0.9μm and the largest particle diameter of 2μm or less. |
