| 摘要 |
PROBLEM TO BE SOLVED: To stabilize temperature of a vapor deposition material liquid while preventing backflow of a vapor deposition material gas to a solid material supply section, in an evaporation source of a vapor deposition device having a material supply section, and to stabilize long time operation by preventing variation in the vapor deposition rate, and contamination and clogging of the material supply section due to the gas.SOLUTION: In a vapor deposition device including a vacuum chamber, an evaporation source built in the vacuum chamber, the evaporation source includes a material supply section for supplying a solid vapor deposition material, a heating source for heating the vapor deposition material, a melting section for melting the vapor deposition material to liquid, and an evaporation section for evaporating the liquid to generate gas. The vapor deposition device has a configuration for discharging the gas from the evaporation section, and depositing the vapor deposition material on a substrate introduced into the vacuum chamber, a backflow preventing section is provided between the melting section and the evaporation section, and the backflow preventing section has a configuration for sealing the flow path of the gas with the liquid. |
