发明名称 IMAGING ELEMENT UNIT FOR ELECTRONIC ENDOSCOPE, IMAGING ELEMENT MODULE FOR ELECTRONIC ENDOSCOPE AND ELECTRONIC ENDOSCOPE
摘要 PROBLEM TO BE SOLVED: To enlarge a board area of an imaging element unit without axially extending the imaging element unit and also without stacking a circuit board.SOLUTION: An imaging element unit 14 for an electronic endoscope includes: an imaging element 11; and a circuit board 13 on a flat plate where the imaging element 11 is packaged. The circuit board 13 is larger than the imaging element 11, and provided with an extension part extending outward over the outer edge of the packaged imaging element 11. The extension part is provided with holes 13A or cutouts corresponding to various channels provided at a tip part 20 of an endoscope. In the circuit board 13, a lens unit 15 is mounted on the front of the imaging element 11 through a holder 17 (an imaging element module 10). The lens unit 15 is fitted in a hole 21 of the tip part 20. The position of the hole 13A is located in a hole 22 of the tip part 20, and a forceps insertion pipe 18 is mounted in the hole 22 through the hole 13A.
申请公布号 JP2014104111(A) 申请公布日期 2014.06.09
申请号 JP20120258690 申请日期 2012.11.27
申请人 HOYA CORP 发明人 KOSHI ATSUSHI
分类号 A61B1/04;G02B23/26 主分类号 A61B1/04
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