发明名称 Adhesive Film and Encapsulation Method of Organic Electronic Device Using the Same
摘要 PURPOSE: An adhesive film is provided to control viscosity at room temperature and use temperature, thereby obtaining excellent room temperature handling and maintaining uniform thickness. CONSTITUTION: An adhesive film comprises an adhesive layer(22) which includes a curable resin and a moisture absorbent. The adhesive layer has a viscosity of 10^1-10^6 Pa·s at 30-130°C and a viscosity of 10^6 Pa·s at room temperature. A sealing method of an organic electronic device comprises a step of applying the adhesive film to a substrate in which the organic electronic device is formed in the upper part, to cover the front side of the organic electronic device; and a step of curing the adhesive film.
申请公布号 KR101404361(B1) 申请公布日期 2014.06.09
申请号 KR20120129018 申请日期 2012.11.14
申请人 发明人
分类号 C09J7/02;C09J11/00;C09J201/00;H01L51/50 主分类号 C09J7/02
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