| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique to inhibit the occurrence of peeling in a resin member for encapsulating a semiconductor element and mounting members.SOLUTION: A semiconductor device 100 comprises: a semiconductor element 20; lead frames 22, 24; and a resin member 40 which encapsulates the semiconductor element 20 and the lead frames 22, 24. The resin member 40 is an epoxy resin incorporated with silica, and includes a first layer 42 and a second layer 44 overlapped under the first layer 42. A silica concentration of the second layer 44 is lower than a silica concentration of the first layer 42. The semiconductor element 20 is encapsulated in the first layer 42 and the lead frames 22, 24 are encapsulated in the second layer 44. At a boundary 43 the first layer 42 and the second layer 44, the epoxy resin in the first layer 42 and the epoxy resin in the second layer 44 are cross-linked. |
