LAMINATION-TYPE SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a lamination-type semiconductor package that allows keeping the thickness of a package-on-package structure to a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other.SOLUTION: A lamination-type semiconductor package according to the present invention includes: an upper package 10 having an upper flip-chip 16 mounted on an upper substrate 12; a lower package 20 having a lower flip-chip 26 mounted on a lower substrate 22 and disposed so that the upper flip-chip and the lower flip-chip are closely contacted to each other; a heat-dissipation adhesive member 30 adhesively fixing the upper flip-chip and the lower flip-chip and dissipating heat generated from the upper flip-chip and the lower flip-chip; and a molding member 50 molding between the upper substrate and the lower substrate.