| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for resuming a process for advancing and retracting a sawing wire in a special sequence so that a deep incision does not remain on a wafer surface even when resuming a cutting process after being interrupted.SOLUTION: The sawing wire is alternately moved at a specified time interval forward in a length L1 and backward in a length shorter than L1 until a wire web formed by the sawing wire reaches an interruption position of the cutting process or a workpiece reaches the interruption position of the cutting process. When resuming a processing process after stopping the sawing wire by intruding it into a cut sawing mesh in which the workpiece exists, a cycle of wire vibration each including one time of an advance motion for moving a wire forward at a speed v by a length L3 and a retract motion for moving backward at a speed v' by a length less than L3, is repeated while increasing L3, and the length of L3 is finally set equal to the wire feed length L1 in the advance motion before interrupting the cutting process. |
