发明名称 |
SHIELD FILM, SHIELD PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SHIELD PRINTED WIRING BOARD |
摘要 |
The present invention provides a shield film, a shield printed wiring board and a method of manufacturing the shield printed wiring board which prevents a defect generated due to adherence with a too large adhesive force or a too small adhesive force by controlling an adhesive force for a protection layer of a separate film. According to the present invention, a shield film (1) with the surface roughness (Ra) of 0.2 to 1.0μm of a protection layer (7) (hard layer(7a)) when exfoliating the separate film (6a) from the protection layer (7) can be manufactured by forming the protection layer (7) by disposing a release layer (6b) on a side which a corresponding uneven unit (61) is formed of the separate film (6a) on which the uneven unit (61) is formed across the entire surface and coating resin; and further forming an electromagnetic shield layer (8). |
申请公布号 |
KR20140068761(A) |
申请公布日期 |
2014.06.09 |
申请号 |
KR20130142971 |
申请日期 |
2013.11.22 |
申请人 |
TATSUTA ELECTRIC WIRE & CABLE CO., LTD. |
发明人 |
IWAI KIYOSHI;YANAGI YOSHIHARU |
分类号 |
H05K9/00;H05K3/28 |
主分类号 |
H05K9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|