发明名称 SHIELD FILM, SHIELD PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SHIELD PRINTED WIRING BOARD
摘要 The present invention provides a shield film, a shield printed wiring board and a method of manufacturing the shield printed wiring board which prevents a defect generated due to adherence with a too large adhesive force or a too small adhesive force by controlling an adhesive force for a protection layer of a separate film. According to the present invention, a shield film (1) with the surface roughness (Ra) of 0.2 to 1.0μm of a protection layer (7) (hard layer(7a)) when exfoliating the separate film (6a) from the protection layer (7) can be manufactured by forming the protection layer (7) by disposing a release layer (6b) on a side which a corresponding uneven unit (61) is formed of the separate film (6a) on which the uneven unit (61) is formed across the entire surface and coating resin; and further forming an electromagnetic shield layer (8).
申请公布号 KR20140068761(A) 申请公布日期 2014.06.09
申请号 KR20130142971 申请日期 2013.11.22
申请人 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. 发明人 IWAI KIYOSHI;YANAGI YOSHIHARU
分类号 H05K9/00;H05K3/28 主分类号 H05K9/00
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