发明名称 |
SHEET FOR FORMING RESIN FILM FOR CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
[Problem] To provide a sheet having excellent bondability, which is capable of imparting a semiconductor device that is obtained using the sheet with heat dissipation characteristics without having a semiconductor wafer or chip subjected to a special process in the production procedure of the semiconductor device, said special process causing increase of steps and complication of the procedure. [Solution] A sheet for forming a resin film for chips according to the present invention comprises a supporting sheet and a resin film-forming layer that is formed on the supporting sheet. The resin film-forming layer contains (A) a binder polymer component, (B) a curable component, (C) an inorganic filler and (D) a silane coupling agent. The inorganic filler (C) contains nitride particles (C1), and the silane coupling agent (D) has a molecular weight of 300 or more. |
申请公布号 |
WO2014083872(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
WO2013JP66471 |
申请日期 |
2013.06.14 |
申请人 |
LINTEC CORPORATION |
发明人 |
AZUMA, YUICHIRO;ICHIKAWA, ISAO |
分类号 |
H01L23/29;C09J11/04;C09J11/06;C09J201/00;H01L21/301;H01L21/52;H01L23/00;H01L23/31;H01L23/373 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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