摘要 |
<p>Disclosed are a warpage buffer structure for a light guide plate (120, 220) and a backlight module. The warpage buffer structure for a light guide plate (120, 220) comprises a first member (111, 211) and a second member (112, 212). One side of the first member (111, 211) contacts one end of the light guide plate (120, 220) of a backlight module; one side of the second member (112, 212) is movably connected to a backboard sidewall (131) of the backlight module; and the second member (112, 212) slides along an extension direction of the backboard sidewall (131). An end surface of one side of the first member (111, 211) away from the light guide plate (120, 220) is provided thereon with a first inclined surface (141, 241); an end surface of one side of the second member (112, 212) away from the backboard sidewall (131) is provided thereon with a second inclined surface (142); and the first inclined surface (141, 241) and the second inclined surface (142) contact and slide in a matching manner. The warpage buffer structure for a light guide plate (120, 220) effectively reduces the warpage degree of the light guide plate (120, 220) due to thermal expansion, and an inclination angle self-locking structure is used, thereby ensuring that the whole warpage buffer structure for the light guide plate (120, 220) is stable and difficult to fall off, and prolonging the service life of the light guide plate (120, 220) and a backlight module.</p> |
申请人 |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.;HSIAO, YUCHUN;CHEN, WEIFENG |
发明人 |
HSIAO, YUCHUN;CHEN, WEIFENG |