| 摘要 |
PROBLEM TO BE SOLVED: To provide apparatuses and methods for providing a printed radio frequency identification (RFID) tag assembly.SOLUTION: The RFID tag assembly includes: a substrate 110 including a top surface; a receiving layer 130, comprising a plurality of receiving pads having conductive properties, located on the top surface of the substrate; and a chip 120 located on the top surface of the substrate. In addition, the RFID tag assembly may include an antenna 140 printed on the receiving layer and bonded to the receiving layer using at least one of a wedge bonding technique and a ball bonding technique. The antenna may include at least one of copper, aluminum, palladium-covered copper, and aluminum-covered copper wire or ribbon. |
