COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE USING THE SAME, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD AND METHOD PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier in which warping of the copper foil is satisfactorily suppressed without being limited by the types of ultra-thin copper layers and carriers and the thicknesses of the copper layers and carriers.SOLUTION: There is provided a copper foil with a carrier which is provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier and an ultra-thin copper layer laminated on the intermediate layer, wherein the residual stress of the outer surface of the copper foil carrier and the residual stress of the outer surface of the ultra-thin copper layer are both contraction stresses or are both tensile stresses.