发明名称 |
Method and Apparatus for Fabricating Phosphor-Coated LED Dies |
摘要 |
The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. |
申请公布号 |
US2014151725(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
US201414174929 |
申请日期 |
2014.02.07 |
申请人 |
TSMC Solid State Lighting Ltd. |
发明人 |
Tseng Chi-Xiang;Lee Hsiao-Wen;Wu Min-Sheng;Lin Tien-Min |
分类号 |
H01L33/50;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
1. A light-emitting diode (LED) lighting apparatus, comprising
an LED die; and a phosphor film coated conformally around the LED die.
|
地址 |
Hsinchu TW |