| 摘要 |
A gas-liquid two-phase pulverized cleaning device comprises a gas-liquid two-phase pulverized sprayer, the gas-liquid two-phase pulverized sprayer being a bi-layer sleeved structure, and comprising a nozzle (4), a rotation arm (1), a gas guide pipe (2), and a liquid guide pipe (3). The nozzle (4) is connected to the rotation arm (1); the gas guide pipe (2) and the liquid guide pipe (3) are fixed on the rotation arm (1), and are each provided with an air-operated valve. Also provided is a cleaning method by using the gas-liquid two-phase pulverized cleaning device. With the cleaning device, a physical force perpendicular to a wafer slot is increased in the cleaning process, so as to deliver the impurities and contaminants in the wafer slot toward the liquid-phase fluid, thereby improving the cleaning efficiency and effect. Moreover, the device uses pulverized fluid to clean the surface of the wafer, thereby reducing the damage to the wafer. |
