发明名称 ADHESIVE AGENT COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE
摘要 The present invention provides: an adhesive agent composition which includes a diene-based rubber (A) having a radiation-curable functional group, and which can be subjected to a curing reaction to form a cured adhesive-agent layer having a thickness of 60 µm and exhibiting a water vapour transmission rate under an atmosphere of 90% relative humidity at a temperature of 40˚C of not more than 30g/(m2∙day); an adhesive sheet provided with the adhesive-agent layer formed using the adhesive agent composition; and an electronic device provided with a sealant formed using the adhesive agent composition. According to the present invention, provided are: an adhesive agent composition useful as a formation material for an adhesive-agent layer exhibiting excellent moisture barrier properties and an excellent balance between adhesive strength and holding power; an adhesive sheet provided with the adhesive-agent layer formed using the adhesive agent composition; and an electronic device provided with a sealant formed using the adhesive agent composition.
申请公布号 WO2014084351(A1) 申请公布日期 2014.06.05
申请号 WO2013JP82172 申请日期 2013.11.29
申请人 LINTEC CORPORATION 发明人 NISHIJIMA KENTA;NAGANAWA SATOSHI;FUCHI EMI
分类号 C09J109/00;C09J7/00;C09J7/02;C09J11/06;C09J121/00;H01L21/56;H01L51/50;H05B33/04 主分类号 C09J109/00
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