发明名称 |
CERAMIC COPPER-METALLIZED WIRING BOARD AND PROCESS FOR PRODUCING SAME |
摘要 |
The present invention pertains to a process for producing a ceramic copper-metallized wiring board, said process including: forming a film which comprises 150 to 250 zinc oxide needle crystals per μm2 on a ceramic base material by a wet method of immersing the ceramic base material in a zinc plating liquid, said zinc oxide needle crystals having a diameter of 20 to 100nm and a length of 120 to 280nm; heat-treating the resulting ceramic base material in the atmosphere at a temperature of 500 to lower than 900º; forming a copper deposit by electroless copper plating or copper electroplating; and subjecting the copper deposit to patterning with an etching resist to form a wiring pattern. According to the process, a ceramic copper-metallized wiring board which exhibit excellent adhesion and which is usable as a wiring board for a power module can be obtained. |
申请公布号 |
WO2014084077(A1) |
申请公布日期 |
2014.06.05 |
申请号 |
WO2013JP81005 |
申请日期 |
2013.11.18 |
申请人 |
NIKKO COMPANY;OSAKA MUNICIPAL TECHNICAL RESEACH INSTITUTE |
发明人 |
NAGASE AYUMI;KAMEI HIROSHI;KIDANI NAOKI;AOKI MAKOTO;SHINAGAWA TSUTOMU |
分类号 |
C23C18/18;C23C18/38;C23C28/00;H05K3/18 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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