Method for polishing front and rear sides of disk for fastidious components, involves extending polishing gap from inner edge of cloth to outer edge of cloth, where height of gap at inner edge differs from height of gap at outer edge

摘要

The method involves providing a disk (5) made of semiconductor material on both front and rear sides between upper and lower polishing plates (8) that are supported with hard and light compressible polishing cloth (1). Distance between the upper and lower polishing plates, and an upper surface (2) of the polishing cloth stays in contact with disk to be polished. A polishing gap extends from an inner edge of the polishing cloth to an outer edge of the polishing cloth, where height of the polishing gap at the inner edge differs from a height of the polishing gap at the outer edge.