A POLYMER/INORGANIC MULTI-LAYER THIN FILM ENCAPSULATION FOR ORGANIC ELECTRONIC DEVICES

摘要

The present invention relates to a multi-layer thin film encapsulation for an organic electronic device and, more specifically, to a multi-layer thin film encapsulation for an organic electronic device which includes a plasma polymer thin film formed by using a cross-shaped precursor having Si-O bonding and an inorganic thin film layer, which ensures flexibility, and has an improved encapsulation property.