| 摘要 |
Disclosed is a wire stock automatic soldering process wherein in a feed processing apparatus, a first workstation feed inlet feeds wire stock to be soldered, which is stripped and cut via a cutting workstation and then guided into a positioning jig of a conveying apparatus, a second workstation feed inlet guides tin solder onto a tin loading mechanism and a third workstation feed inlet guides a terminal to be connected into a soldering structure. The tin loading mechanism flattens and cuts the tin solder to form tin fragments, and rivets the tin fragments by means of die casting to bind the tin fragment at the connection of the wire stock and the terminal. The soldering structure guides the positioning jig fixing the wire stock to be soldered into a soldering workstation, and after accurate positioning with the terminal to be connected, solders the wire stock and the terminal at a constant temperature. Soldering of wire stock is achieved in an automatic manner, and tin solder completely covers the wire end when soldering, so cracking and loosening will not easily occur, extending the service life of the product. Further disclosed is a wire stock automatic soldering machine implementing this process. |
