发明名称 RESIN MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a resin multilayer substrate in which a large number of layers are allowed even at a bending position, while suppressing the impact of bending on the surrounding as much as possible.SOLUTION: A resin multilayer substrate includes a laminate of a plurality of resin layers 2 each including a first resin layer 2x and a second resin layer 2y adjoining in the thickness direction. When viewing the laminate in plan view, there is a bonding region 31 where the first resin layer 2x and second resin layer 2y are bonded each other, and a non-bonding region 32 where the first resin layer 2x and second resin layer 2y are in positional relationship of abutting each other but are not bonded each other. The second resin layer 2y may be separated from the first resin layer 2x and bent in the non-bonding region 32.
申请公布号 JP2014103141(A) 申请公布日期 2014.06.05
申请号 JP20120252101 申请日期 2012.11.16
申请人 MURATA MFG CO LTD 发明人 OTSUBO YOSHITO
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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