发明名称 |
COMPOUND SEMICONDUCTOR MANUFACTURING APPARATUS AND WAFER HOLDING BODY |
摘要 |
<p>PROBLEM TO BE SOLVED: To inhibit alteration in the composition in epitaxial growth of a compound semiconductor.SOLUTION: A wafer holding body 30 for holding a wafer W in an MOCVD apparatus comprises: a loading member 40 for loading the wafer W; and a ring-shaped restriction member 50 loaded on the loading member 40, for restricting transfer of the wafer W loaded on the loading member 40. A top face of the loading member 40 has a wafer loading surface for loading the wafer W and a ring loading surface for loading the restriction member 50. The wafer loading surface is formed to project upward from the ring loading surface and has a convex shape where a central part projects from a peripheral part. An arithmetic mean roughness Ra of the wafer loading surface is set at not greater than 0.5μm.</p> |
申请公布号 |
JP2014103364(A) |
申请公布日期 |
2014.06.05 |
申请号 |
JP20120256390 |
申请日期 |
2012.11.22 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
YASUHARA HIDEKI;YOSHIMURA KAZUTAKA |
分类号 |
H01L21/205;C23C16/34;C23C16/458;H01L21/683 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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