发明名称 MOUNTING AID TOOL TO BE ATTACHED TO FINGER TIP
摘要 <p>PROBLEM TO BE SOLVED: To provide a mounting aid tool which can perform solder mounting efficiently and reliably.SOLUTION: A mounting aid tool to be attached to a finger tip 7 is created by using one soft metal wire which is easily wound by a finger around the mounting aid tool and the finger tip 7. A brush tip and/or a toothpick 8, and solder wire and/or solder suction wire being consumable materials are used in the mounting aid tool. A front portion 2 of the soft wire is wound directly around a rear portion of the brush tip or the toothpick 8 to fasten the same. Furthermore, the solder wire or the solder suction wire being the consumable materials is inserted into a soft plastic tube. Firstly, a front portion of the soft wire is wound about the soft plastic tube to fasten the tube before the wire is inserted thereinto to be drawn out and held from the front. A rear portion of the soft wire is wound about the finger tip to hold the mounting aid tool at the finger tip. When holding a soldering iron in the right hand, the solder suction wire is held by, for example, the middle finger of the left hand, and in this state flux is coated on a tip of the soldering iron by using the brush tip on the ring finger. The solder wire is then supplied to the heated soldering iron tip by using the forefinger to wet the solder, and a surface mounting component is surface mounted while being pressed with the toothpick on the thumb.</p>
申请公布号 JP2014100723(A) 申请公布日期 2014.06.05
申请号 JP20120253821 申请日期 2012.11.20
申请人 KOHAMA KYOICHI 发明人 KOHAMA KYOICHI
分类号 B23K3/00;B23K1/018;B23K3/06;B23K101/42;H05K3/34 主分类号 B23K3/00
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