PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIGHT-INDUCED PLATING JOINTLY AND METHOD OF THE SAME

摘要

The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (1), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath (209), a first plating unit (200) comprising a plurality of anode members (210) symmetrically disposed on both sides of the plating bath (209) facing the wafer (1), the first plating unit performing electroplating; and a second plating unit (300) disposed in a light source receiving unit (320) physically blocked from the first plating unit (200), the second plating unit (300) being disposed at a rear side of the anode members (210) to perform light-induced plating by using an light emitting diode (LED) lamp (301) irradiating light onto the wafer (1).

主权项

1. A plating equipment comprising:
a jig holding a wafer to be plated at a center of a plating bath such that the wafer is vertically immersed into a plating solution in the plating bath; a first plating unit including a plurality of anode members symmetrically disposed on both sides of the plating bath facing the wafer, the first plating unit performing electroplating; and a second plating unit disposed in a light source receiving unit physically blocked from the first plating unit, the second plating unit being disposed behind the anode members to perform light-induced plating by using a light emitting diode (LED) lamp irradiating light onto the wafer.