SEMICONDUCTOR PACKAGE

摘要

A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI).

主权项

1. A semiconductor package, comprising:
a first substrate; a second substrate stacked on the first substrate; at least one lower semiconductor chip formed on the first substrate and at least one upper semiconductor chip formed on the second substrate; a first encapsulation material covering the upper semiconductor chip; a shielding can mounted on the first substrate, the shielding can surrounding the upper and lower semiconductor chips and comprising a soft magnetic material; and a ground connection element electrically connecting the shielding can to a ground voltage.