| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy excellent in stress relaxation resistance property and high strength at the same time, and excellent in various properties such as bendability and conductivity as a Cu-Zn-Sn-based copper alloy for electronic and electrical equipment such as a connector and other terminal materials.SOLUTION: A copper alloy contains Zn of over 2 mass% and less than 23 mass%, Sn of 0.1 mass% or more and 0.9 mass% or less, Ni of 0.05 mass% or more and less than 1.0 mass%, Fe of 0.001 mass% or more and less than 0.10 mass%, P of 0.005 mass% or more and 0.1 mass% or less, and the balance Cu with inevitable impurities, satisfies, by atom ratio, 0.002≤Fe/Ni<1.5, 3<(Ni+Fe)/P<15 and 0.3<Sn/(Ni+Fe)<5, has a ratio of 90% or less of an aspect ratio of a crystal particle diameter of an α phase containing Cu, Zn and Sn of 0.3 or less, and an average particle diameter in a range of 0.1 μm or more and 50 μm or less. |
