| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film which can be pasted at low temperatures and patterned with an alkali developer.SOLUTION: The provided adhesive film is an adhesive film comprising: a polyimide obtained by reacting tetracarboxylic dianhydride and diamines; a radiation-polymerizable compound; and a photopolymerization initiator and having the following characteristics: the diamines include 10-90 mol% of a specified aliphatic ether diamine with respect to all diamines; an adhesive pattern is formed by pasting the adhesive film onto an adhesion target and exposing and then developing, by using a 2.38% aqueous tetramethylammonium hydride solution, the adhesive film; another adhesion target can be adhered to the former adhesion target via the adhesive pattern.</p> |
