发明名称 |
ETCHING AGENT FOR COPPER OR COPPER ALLOY |
摘要 |
<p>Object is to provide an etching solution which generates less foam and can etch copper or copper alloy at high selectivity when used in a step of etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel. The etching solution to be used in a step of selectively etching copper or copper alloy in an electronic substrate having both of copper or copper alloy and nickel has, as essential components thereof, (A) a linear alkanolamine, (B) a chelating agent having an acid group in the molecule thereof, and (C) hydrogen peroxide.</p> |
申请公布号 |
KR20140068255(A) |
申请公布日期 |
2014.06.05 |
申请号 |
KR20147011679 |
申请日期 |
2012.09.28 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS INC. |
发明人 |
KOJIMA TSUTOMU;KOJI YUKICHI |
分类号 |
C23F1/44;C09K13/00;C23F1/18;H01L21/306 |
主分类号 |
C23F1/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|