| 摘要 |
A bonding layer applied to a touch panel. The touch panel comprises a cover plate and a touch layer, wherein the touch layer comprises an electrode layer and a circuit layer, with the circuit layer being located in the periphery of the electrode layer and being electrically connected to the electrode layer. The bonding layer is arranged between the cover plate and the touch layer, and the bonding layer comprises a transparent main body corresponding to the electrode layer and a shading part corresponding to the circuit layer. Also provided at the same time is a preparation method for a bonding layer applied to a touch panel. A bonding layer with a nontransparent shading part is directly adopted by a touch panel, so that reliability problems in the traditional technology, such as the bonding layer generating bubbles when climbing, can be avoided. |
