| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sheet for producing a wiring circuit board having high solvent resistance.SOLUTION: A resin sheet 20a is for producing a wiring circuit board connectable to an electrode formed on a semiconductor chip. After thermally cured at 180°C for 1 hour and immersed in methyl ethyl ketone of 20°C-25°C for 2400 seconds, the weight loss rate of the resin sheet 20a is 1.0 wt.% or lower. Elution to the methyl ethyl ketone can be suppressed, and a high-precision wiring circuit board can be manufactured. |
