发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting device capable of avoiding a collision between a cutting liquid supply block and a workpiece when returning a cutting blade from a sub-chuck table onto a chuck table after cutting blade dressing has ended even if a thick workpiece is cut.SOLUTION: A cutting device comprises: a chuck table which sucks and holds a workpiece on a holding surface thereof; cutting means with a cutting blade for cutting the workpiece held on the chuck table; processing feeding means which relatively moves the cutting means and the chuck table in a processing feeding direction; and a sub-chuck table disposed adjacent to the chuck table having a holding surface substantially on the same plane as the holding surface of the chuck table. The cutting device also includes a raising plate which is detachably held on the sub-chuck table. Height of an upper surface of a dressing board held via the raising plate held on the sub-chuck table is set so as to be substantially equal height of an upper surface of the workpiece held on the chuck table.
申请公布号 JP2014103341(A) 申请公布日期 2014.06.05
申请号 JP20120255947 申请日期 2012.11.22
申请人 DISCO ABRASIVE SYST LTD 发明人 FUKUOKA TAKEOMI;TOMOCHIKA TETSUHIKO;YOSHIDA KEIGO
分类号 H01L21/301 主分类号 H01L21/301
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