| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting system and an electronic component mounting method capable of achieving a desired bonding quality by appropriately applying a mounting position correction using a solder print position as a reference.SOLUTION: The electronic component mounting system provides a first mounting mode in which an electronic component is transferred and mounted at a mounting position which is corrected based on a positional displacement amount between a position of a printed solder and a position of an electrode, and a second mounting mode in which an electronic component is transferred and mounted at a mounting position using a position of an electrode only. A piece of mounting information 40(2) previously includes an actual mounting mode for each electronic component. In the component mounting operation, the electronic component is mounted on a board according to the preset mounting mode in the mounting information 40(2). With this, the mounting position correction using the solder print position as the reference can be appropriately applied according to the characteristics of the electronic component. Thus, a desired bonding quality can be achieved. |
