发明名称 RESIN COMPOSITION FOR SHEET MOLDING, RESIN SHEET USING THE SAME AND PACKAGE FOR HEAT TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for sheet molding excellent in transparency, flexibility, heat resistance, low temperature impact resistance and secondary processing suitability.SOLUTION: A resin composition for sheet molding consists of a propylene resin composition (X) containing (A) a propylene resin composition satisfying (A-i) to (A-ii) of 1 to 98 wt.%, (B) a modifier satisfying (B-i) of 1 to 50 wt.% and (C) a polypropylene resin having a branch structure satisfying (C-i) of 1 to 50 wt.%. (A-i) Contains a propylene (co)polymer component having a melting peak temperature of 120 to 170°C of 30 to 70 wt.% and a propylene-α-olefin random copolymer component having a content of α-olefin of 7 to 30 wt.% of 70 to 30 wt.%. (A-ii) MFR is 0.5 to 20 g/10 minutes. (B-i) The modifier selected from (B-i) an ethylene-α-olefin copolymer and a styrenic elastomer. (C-i) The melting tensile force (MT) (unit:g) satisfies log(MT)≥-0.9×log(MFR)+0.7 or MT≥15.
申请公布号 JP2014101497(A) 申请公布日期 2014.06.05
申请号 JP20130214847 申请日期 2013.10.15
申请人 JAPAN POLYPROPYLENE CORP 发明人 KADOWAKI YUJI;KANAI GEN
分类号 C08L23/10;A61J1/10;B65D30/02;B65D65/40;B65D77/00;C08L23/08;C08L53/02 主分类号 C08L23/10
代理机构 代理人
主权项
地址