| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an etching solution with high stability, which foams less at the time of use and which can highly selectively perform the etching of copper or copper alloy, in a process of etching copper or copper alloy from an electronic substrate having a layer comprising a copper or copper alloy and a layer comprising a nickel, and from an electronic substrate having a layer comprising a copper or copper alloy and a layer comprising a tin or tin alloy.SOLUTION: Use an etching solution for a process to selectively etch the layers comprising a copper or copper alloy from an electronic substrate having a layer comprising a copper or copper alloy and a layer comprising a nickel, and from an electronic substrate having a layer comprising a copper or copper alloy and a layer comprising a tin or tin alloy, and use the etching solution for copper or copper alloy comprising alkoxy alkyl amine (A) as essential component.</p> |
