SEMICONDUCTOR DEVICE

摘要

In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit and chip-side connecting terminals. An interconnect substrate is placed over the first semiconductor chip and the second semiconductor chip. The interconnect substrate includes a second inductor and substrate-side connecting terminals. The second inductor is located above the first inductor. The chip-side connecting terminals and the two substrate-side connecting terminals are connected through first solder balls.

主权项

1. A semiconductor device comprising:
a first semiconductor chip having a first circuit being capable of generating a signal and a first inductor electrically connected to said first circuit formed on a main surface thereof; a second semiconductor chip having a second circuit being capable of processing said signal formed on a main surface thereof; and an interconnect substrate having wiring layers and a second inductor connected to one of said wiring layers, wherein said first semiconductor chip is mounted on said interconnect substrate such that said main surface of said first semiconductor chip is faced to one portion of said interconnect substrate and such that said first inductor and said inductor are overlapped to each other in a plan view, wherein said second semiconductor chip is mounted on said interconnect substrate said main surface of said second semiconductor chip is faced to the other portion of said interconnect substrate and such that said second circuit is electrically connected to said second inductor via said one of said wiring layers, and wherein said first circuit of said first semiconductor chip and said second circuit of said second semiconductor chip are electrically connected to each other in contactless manner by said first and second inductors.