THERMOSETTING RESIN SHEET AND ELECTRONIC COMPONENT PACKAGING FABRICATION METHOD

摘要

Provided are a thermosetting resin sheet and an electronic component packaging fabrication method using the sheet that make it possible to manufacture high quality electronic component packaging in a stable manner without fluctuations in the resin composition, even when carrying out resin sealing of a large area. The present invention is a B stage thermosetting resin sheet which contains inorganic filler and which has a plan view projection area of at least 31400 mm2.