| 摘要 |
The present invention relates to a chip card and a method for the production of a chip card having a chip (21) which is arranged in a card body, and having a plurality of components (18, 19, 22) being electrically conductively connected to the chip by means of a conductor arrangement (20), wherein the card body is composed of a plurality of substrate layers (11, 12, 13) which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (23, 24, 25, 26, 31, 32, 33, 34), which are disposed so as to overlap one another, for producing an electrically conductive contacting. |
