| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide-imide resin composition capable of forming a resin film difficult to absorb moisture with smaller dimensional change by moisture absorption.SOLUTION: A polyamide-imide resin composition includes: a polyamide-imide resin (A); and a compound (B) including a C=O group, an S=O group or a P=O group. In the polyamide-imide resin composition, a ratio B/A of the number of amide bonds A of the polyamide-imide resin (A) and the mol number B mol of the compound (B) is 0.1-0.7. |
