| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of determining the dropping position of imprint resin while taking account of the positional deviation of the landing position of imprint resin, and to provide an imprint method using that method, and a manufacturing method of a semiconductor device.SOLUTION: In a method of determining the dropping position of imprint resin on a transferred surface by ink jet method, the imprint resin is dropped according to a dropping position predetermined based on the uneven pattern of an ink mold. At the landing position of imprint resin dropped according to the predetermined dropping position, positional deviation has occurred for the predetermined dropping position. When the predetermined dropping position can be corrected, it is corrected, and the corrected dropping position is determined as the dropping position of imprint resin on a transferred surface. |
