发明名称 COMPOSITE COMPOSITIONS FOR ELECTRONICS APPLICATIONS
摘要 An electronics composition includes a curable matrix material and, optionally, a filler material disposed within the matrix material. The cured matrix material includes an oligomer or polymer material derived from a compound selected from a methylene malonate monomer, a multifunctional methylene monomer, a methylene beta ketoester monomer, a methylene beta diketone monomer, or a mixture thereof.
申请公布号 WO2014085570(A1) 申请公布日期 2014.06.05
申请号 WO2013US72203 申请日期 2013.11.27
申请人 BIOFORMIX, INC. 发明人 MALOFSKY, BERNARD, MILES;MALOFSKY, ADAM, GREGG;ELLISON, MATTHEW, MCBRAYER
分类号 H01L21/56 主分类号 H01L21/56
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